Ultra High Precision Bonder FDB210P
It is a super high-precision die bonder optimized for mass production of optical devices.
This machine is a high-precision bonder for the production of optical communication modules/optical devices suitable for mass production. It also supports flip-chip mounting. It enables ultra-high-precision mounting of microchips on supplied substrates using a two-point recognition method. It is a compact device that integrates chip/substrate supply and finished product storage. Shibuya Kogyo has many years of experience in optical communication modules and optical devices. The FDB210P is one of the devices that incorporates years of know-how.
- Company：澁谷工業 メカトロ統轄本部
- Price：Other
